Vertical Flip Chip Bonding with LAPLACE ® https://pactech.com/wp-content/uploads/2023/03/Vertical-Flip-Chip-Bonding-by-PacTech.mp4 Vertical Flip Chip Bonding powered by PacTech’s unique LAPLACE ® technology. Tan Shing Yee2025-08-27T09:09:08+02:00 Related Posts Ball Grid Array (BGA) Rework with SB² ® Technology 20. May 2024 Solder Stacking with SB² ® -Technology 20. May 2024 SB² ® – SMs Process 20. May 2024 Solder Ball Jetting Process with SB² ® 20. May 2024