Solder Stacking with SB² ® -Technology https://pactech.com/wp-content/uploads/2023/03/Solder-Stacking-with-SB²-Technology-by-PacTech.mp4 Solder stacking (solder jetting multiple solder balls on top of each other) powered by Pac Tech’s unique SB² ® technology. Tan Shing Yee2025-08-27T09:06:19+02:00 Related Posts Ball Grid Array (BGA) Rework with SB² ® Technology 20. May 2024 Vertical Flip Chip Bonding with LAPLACE ® 20. May 2024 SB² ® – SMs Process 20. May 2024 Solder Ball Jetting Process with SB² ® 20. May 2024