Selective Solder Bumping De- & Reballing https://pactech.com/wp-content/uploads/2023/03/PacTech-Selective-Solder-Bumping-De-Reballing.mp4 This video demonstrates the capability of selective solder bumping for deballing and reballing by PacTech. Tan Shing Yee2024-07-31T04:42:55+02:00 Related Posts Ball Grid Array (BGA) Rework with SB² ® Technology 20. May 2024 Solder Stacking with SB² ® -Technology 20. May 2024 Vertical Flip Chip Bonding with LAPLACE ® 20. May 2024 SB² ® – SMs Process 20. May 2024