The SB² ® – Jet provides fine-pitch soldering capability supported by a high accuracy axis system. It has the smallest solder ball diameter capability down to 40μm. it is ideal not only for research & development, prototyping of advanced devices but especially also for mass production.
High Speed Solder Ball Attach and Laser Reflow with SB² ® – Jet
Tan Shing Yee2025-08-27T08:34:20+02:00
