Ball Grid Array (BGA) Rework with SB² ® Technology https://pactech.com/wp-content/uploads/2023/03/Ball-Grid-Array-BGA-Rework-with-SB²-Technology-by-PacTech.mp4 BGA reballing (solder ball removal and solder jetting) powered by Pac Tech’s unique SB² ® technology. Tan Shing Yee2025-08-27T09:11:10+02:00 Related Posts Solder Stacking with SB² ® -Technology 20. May 2024 Vertical Flip Chip Bonding with LAPLACE ® 20. May 2024 SB² ® – SMs Process 20. May 2024 Solder Ball Jetting Process with SB² ® 20. May 2024
