Ball Grid Array (BGA) Rework with SB² Technology https://pactech.com/wp-content/uploads/2023/03/Ball-Grid-Array-BGA-Rework-with-SB²-Technology-by-PacTech.mp4 BGA reballing (solder ball removal and solder jetting) powered by Pac Tech’s unique SB²© technology. Tan Shing Yee2024-07-31T04:19:28+02:00 Related Posts PacTech: Forecast is in Sight (english) 20. May 2024 PacTech und eine erfolgreiche Messe (german) 20. May 2024 Thomas Oppert stellt das Lasersystem SB²-Jet vor (german) 20. May 2024 Interview with CEO Dr. Teutsch at the productronica (english) 20. May 2024
