• Wafer Level

  • Wafer Level CSP

  • Single Chip

  • Optoelectronics/Microoptics

  • Rework/Repair of BGA-like-Packages

  • MEMS & 3D-Packaging

  • PCB

  • Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-Motor)

  • Camera Modules

  • CMOS Sensors

  • BGA/cLCC Balling

  • Filter Devices (SAW, BAW, F-BAR)