Wafer Thinning Service

Thinning the die can benefit electronic devices in several ways:

  • Reducing thermal resistance
  • Improving device performance
  • Increasing reliability
  • Lowering overall package height, minimizing die stress, which occurs due to mismatches in the coefficient of thermal expansion (CTE) between the silicon die and the board materials.

The most common technology for wafer thinning is mechanical grinding. Silicon is removed from the backside of the wafer using a two-step process: coarse grinding followed by fine grinding. This is performed using a grinding tool that contains diamond particles of specific dimensions. During coarse grinding, typically 90% of the back grind is completed, significantly reducing the thickness of the wafer. Coarse grinding will cause micro-cracks and damage the silicon lattice. Fine grinding completes the back grind process and removes part of this damage.