Wafer Level Component Assembly Service

Component assembly on wafer level could save greatly on cost and speed up the cycle time, at the same time reduce the package size. Our wafer level component assembly including solder application, component placement and reflow process, as well as optional optical inspection. The type of components which can be placed on wafer including single chip, diode, capacitor, transistor and other IPD which could form a package directly by mounting on wafer level. The wafer can then be diced and shipped either on sawing ring or taped into reels for further assembly process.

Our wafer level component assembly services including:

  • High throughput low-cost wafer level component assembly

  • High accuracy low stress LAPLACE laser assisted bonding component attach

Bonding and Assembly