Solder Ball Jetting Machine with Wiring Process – SB²-WB

The SB²-WB is a combination of PacTech’s unique solder ball jetting technology with a wire feeding mechanism to perform wiring process. This innovative solution has very low stress as it is bonded with very short laser pulse and requires no mechanical contact. The system is highly flexible, with various loop formation capabilities or even no wire loop formation to enable smaller package size, at the same time allowing combination of different solder alloy and wire, wire bundles or ribbon. Higher reliability as compared to conventional wire bonding with consistent wire thickness and better match of CTE variation between materials. Additionally, the solder wire bond can be reworked selectively at ease. The SB²-WB is a flexible wire-bonding alternative for multifunctional system platforms and heterogeneous integration.

Highlights

  • Soldering mode: Jet mode

  • Available solder ball diameter: 250 – 760μm

  • Recommended soldering condition: wire soldering

  • Solder ball jetting with a wire feeding mechanism

  • Preferred pad material: NiAu, Au, Cu

SOLDER BALL JETTING MACHINE WITH WIRING PROCESS – SB²-WB

For more information about the SB² – WB, you can request the official brochure below.

Applications

  • IC packaging
  • LED packaging
  • connectors
  • optical fibre
  • 2D/3D packaging

Options

  • Rotatable Workholder
  • 2D Ball Inspection System
  • Software function for solder ball amount control
  • Automatic Laser Z-height measurement

Benefits

  • Unique wire soldering capability

PRODUCT CHART

SB2 Product Chart

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