Solder Ball Jetting Machine with Wiring Process – SB²-WB
The SB²-WB is a combination of PacTech’s unique solder ball jetting technology with a wire feeding mechanism to perform wiring process. This innovative solution has very low stress as it is bonded with very short laser pulse and requires no mechanical contact. The system is highly flexible, with various loop formation capabilities or even no wire loop formation to enable smaller package size, at the same time allowing combination of different solder alloy and wire, wire bundles or ribbon. Higher reliability as compared to conventional wire bonding with consistent wire thickness and better match of CTE variation between materials. Additionally, the solder wire bond can be reworked selectively at ease. The SB²-WB is a flexible wire-bonding alternative for multifunctional system platforms and heterogeneous integration.
Highlights
Soldering mode: Jet mode
Available solder ball diameter: 250 – 760μm
Recommended soldering condition: wire soldering
Solder ball jetting with a wire feeding mechanism
Preferred pad material: NiAu, Au, Cu
Applications
- IC packaging
- LED packaging
- connectors
- optical fibre
- 2D/3D packaging
Options
- Rotatable Workholder
- 2D Ball Inspection System
- Software function for solder ball amount control
- Automatic Laser Z-height measurement
Benefits
- Unique wire soldering capability
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SB²-Compact
SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
SB²-SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.