Project Description
Sequential Solder Ball Attach Machine – SB²-SM
The SB²-SM is ideal for research & development, prototyping and small volume manufacturing. The platform is like the SB²-M but with a larger working area and more optional features. It allows you to process the larger soldering target such as wafers or PCB’s.
Highlights
Jet mode/Standard mode
Available solder ball diameter: 60 – 760μm
Suitable for chip/wafer/substrate soldering
Optional ball rework (de-balling & re-balling) capability
Applications
- Wafer Level (CSP & Flip Chip)
- Single Chip
- BGA / cLCC Balling
- Rework/Repair of BGA-like packages
- PCB
- MEMS & 3D-Packaging
- Hard Disk Drive
- Camera Modules
- CMOS Sensors
- Optoelectronics/Microoptics
- Filter Devices (SAW, BAW, F-BAR)
Options
- Solder Ball Rework Station
- Pattern Recognition and Fiducial Alignment
- Upgrade to 8” working area
- Heated chuck/work stage
- Specific heated work holder for BGA-like devices
- Automatic Z-height measurement
Benefits
- High flexibility
- Small solder ball handleability
- Rework function
PRODUCT CHART
RELATED SB²-PRODUCTS
SB²-Compact
SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
SB²-SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
