Sequential Solder Ball Attach Machine – SB²-SM

Being a lower cost version of the SB²-Jet without compromising its placement accuracy, the SB²-SM is a sequential solder ball attach and laser reflow system that can operate either in a fully automatic or in a semiautomatic mode. With larger work area than the SB²-M, yet relatively compact foot print than the SB²-Jet, it is ideal for research & development, prototyping and small volume manufacturing.

Highlights

  • Jet mode/Standard mode

  • Available solder ball diameter: 60 – 760μm

  • Suitable for chip/wafer/substrate soldering

  • Optional ball rework (de-balling & re-balling) capability

SEQUENTIAL SOLDER BALL ATTACH MACHINE – SB²-SM

For more information about the SB² – SM, you can request the official brochure below.

Applications

  • Wafer Level (CSP & Flip Chip)
  • Single Chip
  • BGA / cLCC Balling
  • Rework/Repair of BGA-like packages
  • PCB
  • MEMS & 3D-Packaging
  • Hard Disk Drive
  • Camera Modules
  • CMOS Sensors
  • Optoelectronics/Microoptics
  • Filter Devices (SAW, BAW, F-BAR)

Options

  • Solder Ball Rework Station
  • Pattern Recognition and Fiducial Alignment
  • Upgrade to 8” working area
  • Heated chuck/work stage
  • Specific heated work holder for BGA-like devices
  • Automatic Z-height measurement

Benefits

  • High flexibility
  • Small solder ball handleability
  • Rework function

PRODUCT CHART

SB2 Product Chart

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