Project Description

Sequential Solder Ball Attach Machine – SB²-SM

The SB²-SM is ideal for research & development, prototyping and small volume manufacturing. The platform is like the SB²-M but with a larger working area and more optional features. It allows you to process the larger soldering target such as wafers or PCB’s.

Highlights

  • Jet mode/Standard mode

  • Available solder ball diameter: 60 – 760μm

  • Suitable for chip/wafer/substrate soldering

  • Optional ball rework (de-balling & re-balling) capability

SEQUENTIAL SOLDER BALL ATTACH MACHINE – SB²-SM

For more information about the SB² – SM, you can request the official brochure below.

Applications

  • Wafer Level (CSP & Flip Chip)
  • Single Chip
  • BGA / cLCC Balling
  • Rework/Repair of BGA-like packages
  • PCB
  • MEMS & 3D-Packaging
  • Hard Disk Drive
  • Camera Modules
  • CMOS Sensors
  • Optoelectronics/Microoptics
  • Filter Devices (SAW, BAW, F-BAR)

Options

  • Solder Ball Rework Station
  • Pattern Recognition and Fiducial Alignment
  • Upgrade to 8” working area
  • Heated chuck/work stage
  • Specific heated work holder for BGA-like devices
  • Automatic Z-height measurement

Benefits

  • High flexibility
  • Small solder ball handleability
  • Rework function

PRODUCT CHART

SB2 Product Chart

RELATED SB²-PRODUCTS

2022-03-10T16:18:01+01:00

SB²-M

SB2-M is an entry point for R&D with a small footprint and lower investment.

2022-03-10T16:18:34+01:00

SB²-SM

The SB2-SM is the platform for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2022-03-10T16:19:02+01:00

SB²-WB

SB²-WB is a combination of PacTech’s unique solder ball jetting technology with a wire feeding mechanism to perform wiring process.

2022-03-10T16:19:31+01:00

SB²-Compact

SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2022-03-10T16:21:43+01:00

SB²-SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2022-03-10T16:22:14+01:00

SB²-Jet

SB²-Jet is the platform with the highest placement precision and smallest solder ball capability.

2022-03-10T16:22:51+01:00

SB²-RSP

SB²-RSP system is a flexible robot soldering platform for automated angle-free laser soldering, especially for SMT components.