Project Description

Semiautomatic Solder Ball Placement with Reflow – SB²-M

Entry point for R&D with a small footprint and lower investment

SB²-M is the smallest platform in the SB² series. It is ultra-compact with sufficient workspace, laser reflow and rework capabilities, and is specifically designed for R&D.

Highlights

  • Jet mode/Standard mode

  • Available solder ball diameter: 100 – 760μm

  • Recommended soldering condition: 2D soldering

  • Suitable for chip/small device soldering

  • Optional ball rework (de-balling & re-balling) capability

SEMIAUTOMATIC SOLDER BALL PLACEMENT WITH REFLOW – SB²-M

For more information about the SB² – M, you can request the official brochure below.

Applications

  • CSP
  • Single Chip
  • BGA/cLCC Balling
  • Rework/Repair of BGA-like packages
  • PCB
  • MEMS & 3D-Packaging
  • Camera Modules
  • CMOS Sensors
  • Optoelectronics/Microoptics

Options

  • Solder Ball Rework Station
  • Pattern Recognition and Fiducial Alignment
  • Heated chuck/work stage
  • Specific heated work holder for BGA-like devices
  • Automatic Z-height measurement

Benefits

  • Small footprint
  • Rework function implementable

PRODUCT CHART

SB2 Product Chart

RELATED SB²-PRODUCTS

2022-03-10T16:19:31+01:00
ULTRA-COMPACT LASER SOLDERING MACHINE – SB²-COMPACT
SB²-Compact
Gallery

SB²-Compact

SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2022-03-10T16:19:02+01:00
SOLDER BALL JETTING MACHINE WITH WIRING PROCESS – SB²-WB
SB²-WB
Gallery

SB²-WB

SB²-WB is a combination of PacTech’s unique solder ball jetting technology with a wire feeding mechanism to perform wiring process.

2022-03-10T16:21:43+01:00
HIGH-VOLUME LASER SOLDERING MACHINE – SB²-SMS QUANTUM
SB²-SMs Quantum
Gallery

SB²-SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2022-03-10T16:18:01+01:00
SEMIAUTOMATIC SOLDER BALL PLACEMENT WITH REFLOW – SB²-M
SB²-M
Gallery

SB²-M

SB2-M is an entry point for R&D with a small footprint and lower investment.

2022-03-10T16:18:34+01:00
SEQUENTIAL SOLDER BALL ATTACH MACHINE – SB²-SM
SB²-SM
Gallery

SB²-SM

The SB2-SM is the platform for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2022-03-10T16:22:14+01:00
HIGH-SPEED SOLDER BALL ATTACH AND LASER REFLOW – SB²-JET
SB²-Jet
Gallery

SB²-Jet

SB²-Jet is the platform with the highest placement precision and smallest solder ball capability.

2022-03-10T16:22:51+01:00
SMT ROBOT FOR SOLDER BALL ATTACH AND LASER REFLOW – SB²-RSP
SB²-RSP
Gallery

SB²-RSP

SB²-RSP system is a flexible robot soldering platform for automated angle-free laser soldering, especially for SMT components.