Semiautomatic Solder Ball Placement Machine with Reflow – SB²-M
The SB² – M is the smallest available platform in the SB²-series with ultra small foot print yet sufficient work area, being equipped with semi-automatic solder ball placement, laser reflow and rework functions, it is dedicated to prototyping and research & development purposes. This model is commonly used for prototype sample building, reballing, repair and rework of products.
Highlights
Jet mode/Standard mode
Available solder ball diameter: 100 – 760μm
Recommended soldering condition: 2D soldering
Suitable for chip/small device soldering
Optional ball rework (de-balling & re-balling) capability
Applications
- CSP
- Single Chip
- BGA/cLCC Balling
- Rework/Repair of BGA-like packages
- PCB
- MEMS & 3D-Packaging
- Camera Modules
- CMOS Sensors
- Optoelectronics/Microoptics
Options
- Solder Ball Rework Station
- Pattern Recognition and Fiducial Alignment
- Heated chuck/work stage
- Specific heated work holder for BGA-like devices
- Automatic Z-height measurement
Benefits
- Small footprint
- Rework function implementable
PRODUCT CHART
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