Project Description

Semiautomatic Solder Ball Placement with Reflow – SB²-M

Entry point for R&D with a small footprint and lower investment

SB²-M is the smallest platform in the SB² series. It is ultra-compact with sufficient workspace, laser reflow and rework capabilities, and is specifically designed for R&D.

Highlights

  • Jet mode/Standard mode

  • Available solder ball diameter: 100 – 760μm

  • Recommended soldering condition: 2D soldering

  • Suitable for chip/small device soldering

  • Optional ball rework (de-balling & re-balling) capability

SEMIAUTOMATIC SOLDER BALL PLACEMENT WITH REFLOW – SB²-M

For more information about the SB² – M, you can request the official brochure below.

Applications

  • CSP
  • Single Chip
  • BGA/cLCC Balling
  • Rework/Repair of BGA-like packages
  • PCB
  • MEMS & 3D-Packaging
  • Camera Modules
  • CMOS Sensors
  • Optoelectronics/Microoptics

Options

  • Solder Ball Rework Station
  • Pattern Recognition and Fiducial Alignment
  • Heated chuck/work stage
  • Specific heated work holder for BGA-like devices
  • Automatic Z-height measurement

Benefits

  • Small footprint
  • Rework function implementable

PRODUCT CHART

SB2 Product Chart

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