Automated Machine for Electroless Deposition – PACLINE 300

PacLine 300 A50 – is a fully automated equipment for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers with Al or Cu pad metallization. The system is able to process wafers up to 12”.

The PacLine contains of a complete software solution for recipe management, process control and data logging. Complex failure and emergency routines are providing a secure system operation for handling of up to 4 process carrier in parallel. The usage of SECS GEM communication protocol enables direct interfacing with the facility host and flexible final adjustment on customer requirements.

PacTech is offering standard configured and industry proven bumping line’s as well as customized wet benches. The modular bumping line consists of an input/output station, a customized number of process modules, Quick Dump Rinse tanks, drying station and automatic Ni stripping.

PacTech offers a turnkey solution by delivering the equipment and the process chemicals in combination with a technology transfer.

Highlights

  • Maximum Flexibility: 4“-12“
  • UPH: up to 600,000 wafer per year 8“
  • No tooling
  • In-line Bath Control and Replenishment
  • Total Quality Software for recipe management, process control, data logging
  • SECS GEM Interface optional
  • Turnkey Process Solution

For more information about the PacLine 300, you can request the official brochure below.

Applications

  • WLCSP Flip Chip
  • Discrete Components
  • Power MOSFET
  • RFID
  • SAW- and Fbar-Filters
  • Optoelectronics
  • MEMS

Options

  • SECS GEM Interface
  • integration in existing FAB software/hardware infrastructure

Benefits

  • Total Quality Software for recipe management, process control, data logging
  • Already installed at leading OEM production sites
  • World wide support team located at Nauen (Germany); Silicon Valley (USA); Penang (Malaysia); Bangkok (Thailand)
  • Turnkey process solution
  • Equipment, Process Transfer, Chemistry
  • Maximum Flexibility for 4”- 12” with no tooling
  • Compliant with Semi S2 ; FM 4910 and CE
  • Flexibility in customer specific requirements/adaptations