Project Description
Laser Bonder System For Vertical Attachment – LAPLACE-VC
The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage.
The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate.
Highlights
- In-Line capability
- High throughput
- Rotation correction and automatic alignment
Applications
- Vertical Chip Bonding
Options
- Wafer Handling Systems
- Dispenser System
- Substrate Feeder
- Direct Die Feeder
- UV Curing
Benefits
- In-Line capability
- High throughput
- Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
- Vision system
- Rotation correction and automatic alignment
- 90 degree flip unit to present Die to the bonding tool
- Temperature control unit
- Laser class 1 certified tool
RELATED LAPLACE-PRODUCTS
LAPLACE-HT
The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.
LAPLACE-Can
Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.
LAPLACE-VC
The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.
LAPLACE-FC
The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.