Automatic Laser Soldering Machine – LAPLACE-HT
The LAPLACE-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules. The automatic machine punches and forms lead frames, dispenses solder paste and performs diode laser attach to the lead frame. A final electrical and visual test is done on the assembled modules and chip packages within the machine.
Highlights
- Reel-to-reel cutting system for metal lead frame
- Pick and place unit for punched metal parts and assembled parts
- High speed paste dispense
- Diode pick up from die feeder
- Laser soldering
- Electrical test
- Optical test
Applications
- Bypass diode assembly for solar cells
- Chip on lead frame
- RFID
- LED assembly
- µLED assembly
Benefits
- Automated Processes
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