Automatic Laser Soldering Machine – LAPLACE-HT

The LAPLACE-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules. The automatic machine punches and forms lead frames, dispenses solder paste and performs diode laser attach to the lead frame. A final electrical and visual test is done on the assembled modules and chip packages within the machine.

Highlights

  • Reel-to-reel cutting system for metal lead frame
  • Pick and place unit for punched metal parts and assembled parts
  • High speed paste dispense
  • Diode pick up from die feeder
  • Laser soldering
  • Electrical test
  • Optical test

For more informations about the LAPLACE-HT, you can request the official brochure below.

Applications

  • Bypass diode assembly for solar cells
  • Chip on lead frame
  • RFID
  • LED assembly
  • µLED assembly

Benefits

  • Automated Processes

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