Integrated Flip Chip Assembly Machine – LAPLACE-FC

The LAPLACE-system provides an integrated solution for flip chip assembly. The laser assisted assembly is applied for soldering, ACF and NCP interconnections. The optional dispensing unit in the flip chip assembly platform allows a maximal flexibility for flux, solder paste and/or ACF, NCP dispense.

Highlights

  • Flip chip placement, reflow & curing in one step
  • Fluxfree reflow with laser
  • No additional reflow or curing
  • Suitable for Flip Chip Soldering and adhesive Flip Chip: ACF, NCP, ICA
  • Substrate materials:
    – PI, PVC, PE, Polyester
    – Paper based low cost substrates and others

For more information about the LAPLACE-FC, you can request the official brochure below.

Download Brochure

Applications

  • Flip Chip Assembly
  • Flip Chip on Flex
  • Flip Chip on PCB
  • Flip Chip on Wafer
  • Smart Cards
  • Smart Label Products
  • LCD-Drivers
  • Vertical Chip Bonding

Options

  • Wafer Handling Systems
  • Reel to Reel Unit
  • Dispenser System

Benefits

  • In-Line Capability
  • High Throughput
  • Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
  • Vision System
  • Temperature Control Unit
  • Laser Class 1

RELATED LAPLACE-PRODUCTS

2022-07-07T14:42:55+02:00

LAPLACE-HT

The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.

2022-07-21T07:18:12+02:00

LAPLACE-FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

2022-07-07T11:42:44+02:00

LAPLACE-VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.

2022-07-07T11:35:23+02:00

LAPLACE-Can

Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.