Cantilever Assembly and Laser Bonding Machine – LAPLACE-Can

Ultra-fine-pitch cantilever assembly and laser bonding machine for wafer probe cards with optional rework capability.

Highlights

  • Placement accuracy: ≤ +/- 5µm

  • Probe card sizes up to 13 inch
  • Full process control
  • Alignment control by position bonding

For more information about the LAPLACE-Can, you can request the official brochure below.

Applications

  • Wafer Probe Cards

Options

  • Cantilever repair

Benefits

  • Height control accuracy: ≤ 5µm
  • Cantilever thickness: 20 – 100µm
  • Pitch: down to 60µm

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