Cantilever Assembly and Laser Bonding Machine – LAPLACE-Can
Ultra-fine-pitch cantilever assembly and laser bonding machine for wafer probe cards with optional rework capability.
Highlights
Placement accuracy: ≤ +/- 5µm
- Probe card sizes up to 13 inch
- Full process control
- Alignment control by position bonding
Applications
- Wafer Probe Cards
Options
- Cantilever repair
Benefits
- Height control accuracy: ≤ 5µm
- Cantilever thickness: 20 – 100µm
- Pitch: down to 60µm
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Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.
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