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LAPLACE-HT

2022-07-07T14:42:55+02:00

The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.

LAPLACE-VC

2022-07-07T11:42:44+02:00

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.

LAPLACE-Can

2022-11-07T14:49:52+01:00

Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.

LAPLACE-FC

2022-07-21T07:18:12+02:00

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

Ultra-SB² 300

2022-07-07T12:07:32+02:00

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

PacLine 300 A50

2022-07-07T11:52:08+02:00

The PacLine 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

SB²-M

2022-06-24T14:01:20+02:00

SB2-M is an entry point for R&D with a small footprint and lower investment.

SB²-SM

2022-06-24T14:28:29+02:00

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

SB²-WB

2022-11-07T11:14:37+01:00

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.

SB²-Compact

2022-06-24T14:33:33+02:00

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

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