{"id":21168,"date":"2025-08-27T06:52:18","date_gmt":"2025-08-27T04:52:18","guid":{"rendered":"https:\/\/pactech.com\/?p=21168"},"modified":"2026-04-24T04:44:04","modified_gmt":"2026-04-24T02:44:04","slug":"vertical-flip-chip-bonding-with-laplace","status":"publish","type":"post","link":"https:\/\/pactech.com\/ko\/video-ko\/vertical-flip-chip-bonding-with-laplace\/","title":{"rendered":"Vertical Flip Chip Bonding with LAPLACE <sup>\u00ae<\/sup>"},"content":{"rendered":"<div style=\"width: 640px;\" class=\"wp-video\"><video class=\"wp-video-shortcode\" id=\"video-21168-1\" width=\"640\" height=\"480\" preload=\"metadata\" controls=\"controls\"><source type=\"video\/mp4\" src=\"https:\/\/pactech.com\/wp-content\/uploads\/2023\/03\/Vertical-Flip-Chip-Bonding-by-PacTech.mp4?_=1\" \/><a href=\"https:\/\/pactech.com\/wp-content\/uploads\/2023\/03\/Vertical-Flip-Chip-Bonding-by-PacTech.mp4\">https:\/\/pactech.com\/wp-content\/uploads\/2023\/03\/Vertical-Flip-Chip-Bonding-by-PacTech.mp4<\/a><\/video><\/div>\n<p>Vertical Flip Chip Bonding powered by PacTech&#8217;s unique LAPLACE \u00ae technology.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Vertical Flip Chip Bonding powered by PacTech&#8217;s unique LAPLACE \u00ae<\/p>\n","protected":false},"author":4,"featured_media":20151,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"content-type":"","footnotes":""},"categories":[640],"tags":[630,632],"class_list":["post-21168","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-video-ko","tag-laplace-ko","tag-processes-ko"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - 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