{"id":21168,"date":"2025-08-27T06:52:18","date_gmt":"2025-08-27T04:52:18","guid":{"rendered":"https:\/\/pactech.com\/?p=21168"},"modified":"2025-08-27T09:07:34","modified_gmt":"2025-08-27T07:07:34","slug":"vertical-flip-chip-bonding-with-laplace","status":"publish","type":"post","link":"https:\/\/pactech.com\/ko\/vertical-flip-chip-bonding-with-laplace\/","title":{"rendered":"Vertical Flip Chip Bonding with LAPLACE <sup>\u00ae<\/sup>"},"content":{"rendered":"<div style=\"width: 640px;\" class=\"wp-video\"><video class=\"wp-video-shortcode\" id=\"video-21168-1\" width=\"640\" height=\"480\" preload=\"metadata\" controls=\"controls\"><source type=\"video\/mp4\" src=\"https:\/\/pactech.com\/wp-content\/uploads\/2023\/03\/Vertical-Flip-Chip-Bonding-by-PacTech.mp4?_=1\" \/><a href=\"https:\/\/pactech.com\/wp-content\/uploads\/2023\/03\/Vertical-Flip-Chip-Bonding-by-PacTech.mp4\">https:\/\/pactech.com\/wp-content\/uploads\/2023\/03\/Vertical-Flip-Chip-Bonding-by-PacTech.mp4<\/a><\/video><\/div>\n<p>Vertical Flip Chip Bonding powered by PacTech&#8217;s unique LAPLACE \u00ae technology.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Vertical Flip Chip Bonding powered by PacTech&#8217;s unique LAPLACE \u00ae<\/p>\n","protected":false},"author":4,"featured_media":20151,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"content-type":"","footnotes":""},"categories":[640],"tags":[630,632],"class_list":["post-21168","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-video-ko","tag-laplace-ko","tag-processes-ko"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Vertical Flip Chip Bonding with LAPLACE \u00ae - PacTech - Packaging Technology Equipment &amp; Services<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/pactech.com\/ko\/vertical-flip-chip-bonding-with-laplace\/\" \/>\n<meta property=\"og:locale\" content=\"ko_KR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Vertical Flip Chip Bonding with LAPLACE \u00ae - PacTech - Packaging Technology Equipment &amp; Services\" \/>\n<meta property=\"og:description\" content=\"Vertical Flip Chip Bonding powered by PacTech&#8217;s unique LAPLACE \u00ae\" \/>\n<meta property=\"og:url\" content=\"https:\/\/pactech.com\/ko\/vertical-flip-chip-bonding-with-laplace\/\" \/>\n<meta property=\"og:site_name\" content=\"PacTech - Packaging Technology Equipment &amp; Services\" \/>\n<meta property=\"article:published_time\" content=\"2025-08-27T04:52:18+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-08-27T07:07:34+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/pactech.com\/wp-content\/uploads\/2023\/03\/Vertical-Flip-Chip-Bonding-by-PacTech-1024x576.png\" \/>\n\t<meta property=\"og:image:width\" content=\"1024\" \/>\n\t<meta property=\"og:image:height\" content=\"576\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"Tan Shing Yee\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/pactech.com\\\/ko\\\/vertical-flip-chip-bonding-with-laplace\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/pactech.com\\\/ko\\\/vertical-flip-chip-bonding-with-laplace\\\/\"},\"author\":{\"name\":\"Tan Shing Yee\",\"@id\":\"https:\\\/\\\/pactech.com\\\/ko\\\/#\\\/schema\\\/person\\\/76a9270b7745cf8ab0ac9398b9e042b8\"},\"headline\":\"Vertical Flip Chip Bonding with LAPLACE \u00ae\",\"datePublished\":\"2025-08-27T04:52:18+00:00\",\"dateModified\":\"2025-08-27T07:07:34+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/pactech.com\\\/ko\\\/vertical-flip-chip-bonding-with-laplace\\\/\"},\"wordCount\":29,\"image\":{\"@id\":\"https:\\\/\\\/pactech.com\\\/ko\\\/vertical-flip-chip-bonding-with-laplace\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/pactech.com\\\/wp-content\\\/uploads\\\/2023\\\/03\\\/Vertical-Flip-Chip-Bonding-by-PacTech.png\",\"keywords\":[\"LAPLACE \u00ae\",\"Processes\"],\"articleSection\":[\"Video Category KOR\"],\"inLanguage\":\"ko-KR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/pactech.com\\\/ko\\\/vertical-flip-chip-bonding-with-laplace\\\/\",\"url\":\"https:\\\/\\\/pactech.com\\\/ko\\\/vertical-flip-chip-bonding-with-laplace\\\/\",\"name\":\"Vertical Flip Chip Bonding with LAPLACE \u00ae - PacTech - Packaging Technology Equipment &amp; 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