Selective Post-Soldering Volume Adjustment for Improved Co-Planarity of C4 Bump Interfaces<\/a><\/p>\n<\/div><\/li> Chip Scale Review: Direct laser reflow techniques for stable and reliable solder bump interfaces on semiconductor substrates<\/a><\/p>\n<\/div><\/li><\/ul> A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications<\/a><\/p>\n<\/div><\/li> ISES – Innovative laser assisted bonding process for next generation advanced packaging<\/p>\n<\/div><\/li> iMAPS – Laser assisted bonding as recommended soldering technology for next generation sensor packaging<\/p>\n<\/div><\/li> IEMT – Innovative laser assisted bonding technologies for next generation advanced packaging<\/p>\n<\/div><\/li> EPP – Advanced Laser Assisted Bonding Technologies for high-power device assembly<\/p>\n<\/div><\/li> Exploring direct laser reflow techniques for forming stable and reliable solder bump interfaces on semiconductor substrates<\/a><\/p>\n<\/div><\/li><\/ul> Forming of advanced THT-interconnects using SB\u00b2 \u00ae laser solder jetting process<\/a><\/p>\n<\/div><\/li> Next generation advanced packaging using innovative laser assisted bonding equipment<\/p>\n<\/div><\/li><\/ul> Innovative laser assisted 3.5 D \u00ae and SB\u00b2 \u00ae WB assembly processes for next generation advanced packaging<\/p>\n<\/div><\/li> Versatile hermetically sealed sensor platform for high frequency applications<\/a><\/p>\n<\/div><\/li> Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures<\/a><\/p>\n<\/div><\/li>2024\ub144 <\/span>\ud559\uc220 \uc790\ub8cc<\/h2><\/div>
2023\ub144 <\/span>\ud559\uc220 \uc790\ub8cc<\/h2><\/div>
2021\ub144 <\/span>\ud559\uc220 \uc790\ub8cc<\/h2><\/div>