1.0PacTech - Packaging Technology Equipment & Serviceshttps://pactech.com/ko/LAPLACE ®- 3.5D ® | 수직 실장용 레이저 본딩 설비rich600338<blockquote class="wp-embedded-content" data-secret="8J2D3K3mWa"><a href="https://pactech.com/ko/equipment-item/laplace-3-5d/">LAPLACE ® – 3.5D ®</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://pactech.com/ko/equipment-item/laplace-3-5d/embed/#?secret=8J2D3K3mWa" width="600" height="338" title="“LAPLACE ® – 3.5D ®” — PacTech - Packaging Technology Equipment & Services" data-secret="8J2D3K3mWa" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript">
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https://pactech.com/wp-content/uploads/2022/11/LaPlace-Can-e1675330477721.jpg720720PacTech의 LAPLACE®-3.5D® 레이저 보조 본딩 플랫폼은 웨이퍼 프로브 카드의 초미세 피치 캔틸레버 조립을 위한 솔루션으로, 리워크 옵션을 제공합니다.