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Innovative laser assisted 3.5D and SB² WB assembly processes for next generation advanced packaging

by M. Fettke

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Versatile hermetically sealed sensor platform for high frequency applications

by Kevin Kröhnert, Markus Wöhrmann, Michael Schiffer, Georg Friedrich, Dzmitry Starukhin, Martin Schneider-Ramelow, Winfried Mayer, Tobias Chaloun, Thomas Galler, Christian Waldschmidt, Malte Schulz-Ruhtenberg, Norbert Ambrosius, Ulli Hansen

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Assembly and Repair of mini- and µ-LED display panels using innovative laser assisted bonding

by M. Fettke

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Lasergestützte Fügeprozesse als Schlüsseltechnologie der zukünftigen Aufbau- und Verbindungstechnik

by M. Fettke

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Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures

by M. Fettke, R. Baba, T. Kubsch, G. Friedrich, R. Thalmann, V. Bejugam, K. H. Yeoh and Dr. T. Teutsch

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A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

by M. Fettke, T. Kubsch, A. Frick, V. Bejugam, G. Friedrich and Dr. T. Teutsch

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