• e-Ni/Au, e-Ni/Pd and e-Ni/Pd/Au for UBM Applications (2-10um)

  • e-Ni/Au for ACF and ACA Applications (10-25um)

  • e-Ni/Au and e-Ni/Pd for OPM (Wirebonding)

  • Solder Sphere Placement and Jetting (Laser Assisted SB²)
  • Solder Sphere Transfer (Gang Ball Placement)
  • Wafer Level Redistribution and Passivation (BCB and WPR)