Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform

by Kevin Kröhnert, Markus Wöhrmann, Georg Friedrich, Michael Schiffer, Dzimitry Starukhin, Martin-Schneider-Ramelow

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Study of solder interconnect configurations & performance of vertical laser assited assembled “3.5D” packages

by A. Kolbasow, M. Fettke, T. Kubsch, Vinith Bejugam and Dr. T. Teutsch

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A study on laser-assited bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

by M. Fettke, A. Kolbasow, V. Bejugam, T. Kubsch, A. Frick and Dr. T. Teutsch

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Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die ship packages

by M. Fettke, T. Kubsch, A. Kolbasow, V. Bejugam,  A. Frick and Dr. T. Teutsch

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