Wire Bonding Machine

In precise, the technology we are providing is not “Wire Bonding” but “Wire Soldering”.

Wire soldering is the alternative method to get pad and wire connected. The benefit of this process can be summarized as following :

  • No mechanical stress on the chip
  • Wire shows more homogenous heat distribution with ampacity test
  • Lower neck-break risk
  • More flexible loop shape forming

If you want to learn more about wire soldering, please check the paper out from the following link.

Wire Bonding Au Cu

Wire Bonding Equipment



SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.