Solder Ball Mounting Equipment

Ball mounting is a sort of the most popular method to create solder bumps onto a high I/O substrate like a semiconductor wafer. In comparison with the other types of soldering method including laser soldering, this type of process shows better performance for a high I/O substrate.

Our ball mounting machine has 4 process steps:

  • wafer handling from FOUP by a robot
  • flux printing
  • ball mounting
  • rework

Depending on the requirement, you could choose from these functional modules and a customized machine is able to be built. Besides the solder ball mounting, we provide reflow process as a part of bumping service.

Solder Ball Mounting Equipment

2022-07-07T10:43:12+02:00

SB²-Jet

SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.

2022-06-24T14:33:33+02:00

SB²-Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2022-07-07T12:07:32+02:00

Ultra-SB² 300

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

2022-06-24T14:28:29+02:00

SB²-SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2022-06-24T14:01:20+02:00

SB²-M

SB2-M is an entry point for R&D with a small footprint and lower investment.