SOLDER BALL MOUNTING EQUIPMENT
Ball mounting is a sort of the most popular method to create solder bumps onto a high I/O substrate like a semiconductor wafer. In comparison with the other types of soldering method including laser soldering, this type of process shows better performance for a high I/O substrate.
Our ball mounting machine has 4 process steps:
- wafer handling from FOUP by a robot
- flux printing
- ball mounting
- rework
Depending on the requirement, you could choose from these functional modules and a customized machine is able to be built. Besides the solder ball mounting, we provide reflow process as a part of bumping service.
SOLDER BALL MOUNTING EQUIPMENT
SB²-Compact
SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
Ultra-SB² 300
Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.
