LASER SOLDERING WITH SB²
Our laser solder jetting technology is clean, precise, and flexible. Our unique ball handling mechanism supplies a separated single solder ball into the capillary where the laser beam’s thermal energy melts the solder ball, and the solder is deposited to arbitrary positions and being reflowed immediately. It works with various solder alloys of different melting point and requires no flux therefore it is clean.
The localized heat and short pulse are generated by the laser that assures minimal thermal stress is applied on the area beyond the joined surfaces. The selective single solder ball dispensing mechanism requires no tooling for masking soldering locations, hence enables flexible soldering location and contactless soldering.
Highlights
Fluxless
- Mask/Stencil-less
Clean
Precision
- Low Thermal Stress
- 3D Soldering
LASER SOLDERING PROCESS
Choose the bonding mode that best suits your application.
Jet Mode
- Higher throughput
- 3D Soldering is possible
- Can handle smaller balls
Standard Mode
- Better energy efficiency
- For process with flux / For heavily oxidized pads
PRODUCT CHART
SB² PRODUCT FAMILY
SB²-Compact
SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
SB²-SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
