Probe card is one of the most important key component to produce highly reliable semiconductor chips and modules. It acts as an interface between a tester and these semiconductor devices to let the tester to give a series of electrical signals for testing.

Currently, more attention is being paid to MEMS-type probe technology to meet the trend toward higher density.

PacTech offers you to an automated MEMS cantilever probe assembly solution:

• High precision solder deposition with solder balls
• Automated laser assisted bonder with high presision for MEMS cantilever assembly