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Laser Soldering2022-11-01T13:28:30+01:00

Laser Soldering Machine

Soldering is one of the most common process in the various industries such as semiconductor, electrical component, optical component, and more. Despite the long history of the process, soldering is still to the best way to get robust mechanical and electrical interconnection even today.

Our unique soldering solution “Solder Jetting / Jet Mode” provides you a wide range of flexibility that allow you to deal with the difficulties stem from the nature of your products.

Depending on the condition of the products, you can also choose the soldering mode “Standard Mode” that even expand the capability of the machines.

Laser Soldering Modes

Jet Mode

Standard Mode

Laser Soldering Comparison2022-02-18T17:12:21+01:00

Solder Wire

  • Fluxless soldering
  • Higher precision solder volume control by solder ball nature
  • Lower thermal stress

Solder Wire

Stencil Printing

  • Fluxless soldering
  • Higher precision solder volume control by solder ball nature
  • Lower thermal stress

Stencil Printing PT

Ball Drop

  • Fluxless soldering
  • No stencil required
  • Support multiple solder alloy on same wafer
  • Cheap and flexible process for R&D and prototyping
  • Lower thermal stress
  • Ball placement on surface with topography
  • No additional reflow after ball placement
Ball Drop PT

Mini Wave Soldering / Selective Soldering

  • Fluxless soldering
  • Higher precision solder volume control

  • Higher selectivity
  • Better flexibility against more complex terrain
Mini Wave Soldering Selective
Laser Soldering Benefits2021-12-09T10:48:13+01:00
  • Fluxless

  • Mask/Stencil-less

  • Clean
  • Precision
  • 3D Soldering

  • Low Thermal Stress

SB2-RSP with substrate 1
Laser Soldering Applications2021-12-09T10:14:22+01:00
  • Wafer Level

  • Wafer Level Chip Scale Packaging (WLCSP)

  • Single Chip

  • Optoelectronics/Microoptics

  • Rework/Repair of BGA-like-Packages

  • MEMS & 3D-Packaging

  • Printed Circuit Board (PCB)

  • Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-Motor)

  • Camera Modules

  • CMOS Sensors

  • BGA/cLCC Balling

  • Filter Devices (SAW, BAW, F-BAR)

Laser Soldering Video2022-07-07T09:21:16+02:00

This video demonstrates the laser soldering process using our SB²-Jet machine.

Laser Soldering Equipment



SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.



SB2-M is an entry point for R&D with a small footprint and lower investment.



The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.



The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.



Highly flexible laser soldering platform for SMT components, especially for high-volume production in the automotive industry.



SB²-RSP system is a flexible robot soldering machine for automated angle-free laser soldering, especially for SMT components.



SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.


SB²-SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.



SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

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