Laser Soldering Applications
- Wafer Level
- Wafer Level Chip Scale Packaging (WLCSP)
- Single Chip
- Optoelectronics/Microoptics
- Rework/Repair of BGA-like-Packages
- MEMS & 3D-Packaging
- Printed Circuit Board (PCB)
- Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-Motor)
- Camera Modules
- CMOS Sensors
- BGA/cLCC Balling
- Filter Devices (SAW, BAW, F-BAR)