LASER SOLDERING EQUIPMENT
Soldering is one of the most common process in the various industries such as semiconductor, electrical component, optical component, and more. Despite the long history of the process, soldering is still to the best way to get robust mechanical and electrical interconnection even today.
Our unique soldering solution “Solder Jetting / Jet Mode” provides you a wide range of flexibility that allow you to deal with the difficulties stem from the nature of your products.
Depending on the condition of the products, you can also choose the soldering mode “Standard Mode” that even expand the capability of the machines.
LASER SOLDERING MODES
Jet Mode
Standard Mode
Solder Wire
- Fluxless soldering
- Higher precision solder volume control by solder ball nature
Lower thermal stress
Stencil Printing
- Fluxless soldering
- Higher precision solder volume control by solder ball nature
Lower thermal stress
Ball Drop
- Fluxless soldering
- No stencil required
- Support multiple solder alloy on same wafer
- Cheap and flexible process for R&D and prototyping
- Lower thermal stress
- Ball placement on surface with topography
- No additional reflow after ball placement
Mini Wave Soldering / Selective Soldering
- Fluxless soldering
Higher precision solder volume control
- Higher selectivity
- Better flexibility against more complex terrain
Fluxless
Mask/Stencil-less
- Clean
- Precision
3D Soldering
Low Thermal Stress
Wafer Level
Wafer Level Chip Scale Packaging (WLCSP)
Single Chip
Optoelectronics/Microoptics
Rework/Repair of BGA-like-Packages
MEMS & 3D-Packaging
Printed Circuit Board (PCB)
Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-Motor)
Camera Modules
CMOS Sensors
BGA/cLCC Balling
Filter Devices (SAW, BAW, F-BAR)
This video demonstrates the laser soldering process using our SB²-Jet machine.
LASER SOLDERING EQUIPMENT
SB²-SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
SB²-Compact
SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
LAPLACE-HT
The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.
