Laser Soldering Applications

  • Wafer Level
  • Wafer Level Chip Scale Packaging (WLCSP)
  • Single Chip
  • Optoelectronics/Microoptics
  • Rework/Repair of BGA-like-Packages
  • MEMS & 3D-Packaging
  • Printed Circuit Board (PCB)
  • Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-Motor)
  • Camera Modules
  • CMOS Sensors
  • BGA/cLCC Balling
  • Filter Devices (SAW, BAW, F-BAR)