Flip chip is one of the most common methods how to assemble bare chips. One method that is often compared with flip chip is wire bonding. The chip surface with bonding pads are looking upward (Face-up) and the bonding pads are connected to a substrate via metal wires.
In contrast, the chip surface with bonding pads are looking downward (Face-down) with flip chip assembly method. The bonding pads are connected to a substrate via solder bump, ACF and so on.
Following benefits can be obtained with our laser assisted bonding machine for flip chip:
- Depress thermal stress that caused by long reflow time
- The components surrounding bonding area do not get the effect by heat