FLIP CHIP ASSEMBLY EQUIPMENT

Flip chip is one of the most common methods how to assemble bare chips. One method that is often compared with flip chip is wire bonding. The chip surface with bonding pads are looking upward (Face-up) and the bonding pads are connected to a substrate via metal wires.

In contrast, the chip surface with bonding pads are looking downward (Face-down) with flip chip assembly method. The bonding pads are connected to a substrate via solder bump, ACF and so on.

Following benefits can be obtained with our laser assisted bonding machine for flip chip:

  • Depress thermal stress that caused by long reflow time
  • The components surrounding bonding area do not get the effect by heat
Standarf FC Process with laser reflow

FLIP CHIP EQUIPMENT

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LAPLACE-FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

2022-03-10T16:14:32+01:00

PacLine 300 A50

The PacLine 300 A50 is a fully automated equipment for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

2022-03-10T16:11:46+01:00

LAPLACE-VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.

2022-03-10T16:18:34+01:00

SB²-SM

The SB2-SM is the platform for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

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SB²-M

SB2-M is an entry point for R&D with a small footprint and lower investment.

2022-03-10T16:14:04+01:00

Ultra-SB² 300

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

2022-03-10T16:19:31+01:00

SB²-Compact

SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2022-03-10T16:22:14+01:00

SB²-Jet

SB²-Jet is the platform with the highest placement precision and smallest solder ball capability.