3D PACKAGING EQUIPMENT

3D packaging enables stacking of multiple chips that communicate with each other and is part of 3D integration through horizontal as well as vertical connections.

This method provides a more compact way to further improve the performance of a chip while reducing cost and power consumption. The following methods are used in manufacturing, with various advantages and disadvantages:

  • Die-to-Die
  • Die-to-Wafer
  • Wafer-to-Wafer

Contact us if you need more information about 3D packaging.

3.5D Multi Layer Stacked Package

3D PACKAGE EQUIPMENT

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LAPLACE-FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

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SB²-SM

The SB2-SM is the platform for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

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SB²-WB

SB²-WB is a combination of PacTech’s unique solder ball jetting technology with a wire feeding mechanism to perform wiring process.

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PacLine 300 A50

The PacLine 300 A50 is a fully automated equipment for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

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SB²-Jet

SB²-Jet is the platform with the highest placement precision and smallest solder ball capability.

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SB²-RSP

SB²-RSP system is a flexible robot soldering platform for automated angle-free laser soldering, especially for SMT components.

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SB²-Compact

SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

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SB²-SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

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Ultra-SB² 300

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

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SB²-M

SB2-M is an entry point for R&D with a small footprint and lower investment.

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LAPLACE-VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.