3D Packaging Equipment

3D packaging enables stacking of multiple chips that communicate with each other and is part of 3D integration through horizontal as well as vertical connections.

This method provides a more compact way to further improve the performance of a chip while reducing cost and power consumption. The following methods are used in manufacturing, with various advantages and disadvantages:

  • Die-to-Die
  • Die-to-Wafer
  • Wafer-to-Wafer

Contact us if you need more information about 3D packaging.

3.5D Multi Layer Stacked Package

3D Package Equipment

2022-07-07T11:52:08+02:00

PacLine 300 A50

The PacLine 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

2022-07-07T12:05:05+02:00

SB²-RSP

SB²-RSP system is a flexible robot soldering machine for automated angle-free laser soldering, especially for SMT components.

2022-07-07T11:42:44+02:00

LAPLACE-VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.

2022-07-21T07:18:12+02:00

LAPLACE-FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

2022-06-24T14:01:20+02:00

SB²-M

SB2-M is an entry point for R&D with a small footprint and lower investment.

2022-07-07T10:43:12+02:00

SB²-Jet

SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.

2022-06-24T14:35:56+02:00

SB²-SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2022-06-24T14:28:29+02:00

SB²-SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2022-06-24T14:33:33+02:00

SB²-Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2022-06-24T14:30:28+02:00

SB²-WB

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.

2022-07-07T12:07:32+02:00

Ultra-SB² 300

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.