3D PACKAGING EQUIPMENT
3D packaging enables stacking of multiple chips that communicate with each other and is part of 3D integration through horizontal as well as vertical connections.
This method provides a more compact way to further improve the performance of a chip while reducing cost and power consumption. The following methods are used in manufacturing, with various advantages and disadvantages:
- Die-to-Die
- Die-to-Wafer
- Wafer-to-Wafer
Contact us if you need more information about 3D packaging.
3D PACKAGE EQUIPMENT
LAPLACE-FC
The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.
PacLine 300 A50
The PacLine 300 A50 is a fully automated equipment for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.
SB²-Compact
SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
SB²-SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
Ultra-SB² 300
Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.
LAPLACE-VC
The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.