SEMIAUTOMATIC SOLDER BALL PLACEMENT MACHINE WITH REFLOW
SB² – M
The SB² – M is the smallest available platform in the SB²-series with ultra small foot print yet sufficient work area, being equipped with semi-automatic solder ball placement, laser reflow and rework functions, it is dedicated to prototyping and research & development purposes. This model is commonly used for prototype sample building, reballing, repair and rework of products.
Highlights
- Jet mode/Standard mode
- Available solder ball diameter: 100 – 760μm
- Recommended soldering condition: 2D soldering
- Suitable for chip/small device soldering
- Optional ball rework (de-balling & re-balling) capability
Options
- Solder Ball Rework Station
- Pattern Recognition and Fiducial Alignment
- Specific heated work holder for BGA-like devices
- Heated chuck/work stage
- Automatic Z-height measurement
Benefits
- Small footprint
- Rework function implementable
SB² – M Products & Applications
Products
- MEMS & 3D Package
- Camera Modules
- CMOS Sensors
- Opto-Electronics
- Microoptics
Applications
- Prototype Build
- Repair/Rework
- Chip Scale Packaging
- Single Chip
- Ball Grid Array (BGA)
- Printed Circuit Board (PCB)
