{"id":8470,"date":"2022-11-15T08:19:06","date_gmt":"2022-11-15T08:19:06","guid":{"rendered":"https:\/\/test.pactech.com\/advanced-packaging-maschinen\/wafer-bumping-machines-for-assembly-process-interconnections\/"},"modified":"2023-01-18T04:45:14","modified_gmt":"2023-01-18T12:45:14","slug":"wafer-bumping-maschinen-fuer-montageprozess-verbindungen","status":"publish","type":"page","link":"https:\/\/pactech.com\/de\/advanced-packaging-maschinen\/wafer-bumping-maschinen-fuer-montageprozess-verbindungen\/","title":{"rendered":"Wafer-Bumping-Maschinen f\u00fcr Montageprozess-Verbindungen"},"content":{"rendered":"<p><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 fusion-flex-container fusion-parallax-fixed hundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-padding-top:6%;--awb-padding-right:0px;--awb-padding-bottom:0px;--awb-padding-left:0px;--awb-padding-top-medium:0px;--awb-margin-top:0px;--awb-margin-bottom:0px;--awb-background-image:linear-gradient(180deg, rgba(0,0,0,0.9) 0%,rgba(0,0,0,0.7) 100%),url(https:\/\/pactech.com\/wp-content\/uploads\/2022\/11\/PacTech-Wafer-Level-Packaging-Slider-Image-New.jpg);;--awb-background-size:cover;--awb-flex-wrap:wrap;background-attachment:fixed;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-stretch fusion-flex-content-wrap\" style=\"width:calc( 100% + 0px ) !important;max-width:calc( 100% + 0px ) !important;margin-left: calc(-0px \/ 2 );margin-right: calc(-0px \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_1_1 1_1 fusion-flex-column fusion-animated\" style=\"--awb-padding-top:30px;--awb-padding-top-small:0px;--awb-bg-blend:overlay;--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:calc( 0.05 * calc( 100% - 0px ) );--awb-margin-bottom-large:0px;--awb-spacing-left-large:calc( 0.05 * calc( 100% - 0px ) );--awb-width-medium:100%;--awb-spacing-right-medium:calc( 0.05 * calc( 100% - 0px ) );--awb-spacing-left-medium:calc( 0.05 * calc( 100% - 0px ) );--awb-width-small:100%;--awb-spacing-right-small:calc( 0.07 * calc( 100% - 0px ) );--awb-spacing-left-small:calc( 0.07 * calc( 100% - 0px ) );\" data-animationType=\"fadeInLeft\" data-animationDuration=\"2.0\" data-animationOffset=\"top-into-view\"><div class=\"fusion-column-wrapper fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-title title fusion-title-1 fusion-sep-none fusion-title-text fusion-title-size-one\" style=\"--awb-text-color:#ffffff;--awb-margin-top-small:10px;--awb-margin-right-small:0px;--awb-margin-bottom-small:10px;--awb-margin-left-small:0px;\"><h1 class=\"fusion-title-heading title-heading-left\" style=\"margin:0;text-transform:uppercase;\">Wafer-Bumping-Maschinen f\u00fcr Montageprozess-Verbindungen<\/h1><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 fusion_builder_column_1_2 1_2 fusion-flex-column fusion-flex-align-self-center fusion-animated\" style=\"--awb-padding-top:40px;--awb-padding-right:15%;--awb-padding-bottom:40px;--awb-padding-left:40px;--awb-padding-right-medium:5%;--awb-padding-left-medium:5%;--awb-padding-top-small:30px;--awb-padding-right-small:30px;--awb-padding-bottom-small:30px;--awb-padding-left-small:30px;--awb-bg-color:#000000;--awb-bg-color-hover:#000000;--awb-bg-size:cover;--awb-border-color:#ffffff;--awb-border-top:10px;--awb-border-right:10px;--awb-border-bottom:10px;--awb-border-left:10px;--awb-border-style:solid;--awb-width-large:50%;--awb-margin-top-large:50px;--awb-spacing-right-large:calc( -0.2 * calc( 100% - 0px ) );--awb-margin-bottom-large:50px;--awb-spacing-left-large:calc( 0.1 * calc( 100% - 0px ) );--awb-width-medium:50%;--awb-order-medium:0;--awb-spacing-right-medium:calc( 0.1 * calc( 100% - 0px ) );--awb-spacing-left-medium:calc( 0.1 * calc( 100% - 0px ) );--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:calc( 0.07 * calc( 100% - 0px ) );--awb-spacing-left-small:calc( 0.07 * calc( 100% - 0px ) );\" data-animationType=\"fadeInLeft\" data-animationDuration=\"2.0\" data-animationOffset=\"top-into-view\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-center fusion-content-layout-column\"><div class=\"fusion-text fusion-text-1\" style=\"--awb-text-color:#ffffff;\"><p>Wafer Bumping wird h\u00e4ufig in zwei verschiedene Kategorien unterteilt: Flip-Chip-Bumping (FC) und Wafer Level Chip Scale Packaging (WLCSP). Diese Kategorisierung und die damit verbundene Nomenklatur basieren zum Teil auf der Gr\u00f6\u00dfe des L\u00f6tbumps und der Art der f\u00fcr die Herstellung des Bumps verwendeten Ausr\u00fcstung.<\/p>\n<\/div><ul style=\"--awb-line-height:27.2px;--awb-icon-width:27.2px;--awb-icon-height:27.2px;--awb-icon-margin:11.2px;--awb-content-margin:38.4px;--awb-circlecolor:#ad1d3f;--awb-circle-yes-font-size:14.08px;\" class=\"fusion-checklist fusion-checklist-1 fusion-checklist-default type-icons\"><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">\n<p><strong>&#8222;Flip-Chip&#8220;<\/strong> bezieht sich auf Bumps auf Halbleiterwafern, die zwischen 50 und 200 \u00b5m hoch sind und in der Regel mit einem Underfill-Material zwischen dem Chip und dem Substrat montiert werden.<\/p>\n<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">\n<p><strong>&#8222;WLCSP&#8220;<\/strong> bezieht sich auf Bumps mit einer H\u00f6he von 200 bis 500 \u00b5m, die in der Regel ohne Underfill-Material montiert werden.<\/p>\n<\/div><\/li><\/ul><div class=\"fusion-text fusion-text-2\" style=\"--awb-text-color:#ffffff;--awb-margin-top:30px;\"><p>Bei jeder dieser Technologien wird zun\u00e4chst ein Barrieremetall auf das Bondpad des Wafers aufgebracht (Under-Bump-Metallisierung oder UBM), gefolgt von der Abscheidung des Lots. M\u00f6gliche L\u00f6tmittel-Legierungen sind:<\/p>\n<\/div><ul style=\"--awb-line-height:27.2px;--awb-icon-width:27.2px;--awb-icon-height:27.2px;--awb-icon-margin:11.2px;--awb-content-margin:38.4px;--awb-circlecolor:#ad1d3f;--awb-circle-yes-font-size:14.08px;\" class=\"fusion-checklist fusion-checklist-2 fusion-checklist-default type-icons\"><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">SnAgCu (SAC305, SAC405, SAC105)<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">SnAg<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">PbSn 95\/5, PbSn 90\/10<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">AuSn 80\/20<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">InSn<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">SnBi<\/div><\/li><\/ul><div ><a class=\"fusion-button button-3d fusion-button-default-size button-custom fusion-button-default button-1 fusion-button-default-span fusion-button-default-type fusion-has-button-gradient\" style=\"--button_accent_color:#000000;--button_border_color:#000000;--button_accent_hover_color:#000000;--button_border_hover_color:#000000;--button_gradient_top_color:#ffffff;--button_gradient_bottom_color:#c4c4c4;--button_gradient_top_color_hover:#c4c4c4;--button_gradient_bottom_color_hover:#ffffff;--button_margin-top:30px;\" target=\"_self\" href=\"https:\/\/pactech.com\/de\/kontakt\/\"><i class=\"fa-headset fas awb-button__icon awb-button__icon--default button-icon-left\" aria-hidden=\"true\"><\/i><span class=\"fusion-button-text awb-button__text awb-button__text--default\">Kontakt mit Sales aufnehmen<\/span><\/a><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-2 fusion_builder_column_1_2 1_2 fusion-flex-column fusion-flex-align-self-stretch fusion-animated\" style=\"--awb-bg-size:cover;--awb-width-large:50%;--awb-margin-top-large:50px;--awb-spacing-right-large:calc( 0.1 * calc( 100% - 0px ) );--awb-margin-bottom-large:0px;--awb-spacing-left-large:0px;--awb-width-medium:50%;--awb-order-medium:0;--awb-spacing-right-medium:calc( 0.1 * calc( 100% - 0px ) );--awb-spacing-left-medium:calc( 0.1 * calc( 100% - 0px ) );--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:calc( 0.07 * calc( 100% - 0px ) );--awb-spacing-left-small:calc( 0.07 * calc( 100% - 0px ) );\" data-animationType=\"fadeInRight\" data-animationDuration=\"2.0\" data-animationOffset=\"top-into-view\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-center fusion-content-layout-column\"><div class=\"fusion-image-element \" style=\"--awb-mask-url: url(https:\/\/pactech.com\/wp-content\/plugins\/fusion-builder\/\/assets\/images\/masks\/mask-17.svg);--awb-mask-size: cover;--awb-margin-bottom:30px;--awb-caption-title-font-family:var(--h2_typography-font-family);--awb-caption-title-font-weight:var(--h2_typography-font-weight);--awb-caption-title-font-style:var(--h2_typography-font-style);--awb-caption-title-size:var(--h2_typography-font-size);--awb-caption-title-transform:var(--h2_typography-text-transform);--awb-caption-title-line-height:var(--h2_typography-line-height);--awb-caption-title-letter-spacing:var(--h2_typography-letter-spacing);\"><div class=\"awb-image-frame awb-image-frame-1 imageframe-liftup hover-with-mask\"><span class=\" fusion-imageframe imageframe-none imageframe-1 has-mask\"><img decoding=\"async\" width=\"1024\" height=\"768\" alt=\"Solder Ball Placement\" title=\"05\" src=\"https:\/\/pactech.com\/wp-content\/uploads\/2022\/11\/05.jpg\" class=\"img-responsive wp-image-3819\" srcset=\"https:\/\/pactech.com\/wp-content\/uploads\/2022\/11\/05-200x150.jpg 200w, https:\/\/pactech.com\/wp-content\/uploads\/2022\/11\/05-400x300.jpg 400w, https:\/\/pactech.com\/wp-content\/uploads\/2022\/11\/05-600x450.jpg 600w, https:\/\/pactech.com\/wp-content\/uploads\/2022\/11\/05-800x600.jpg 800w, https:\/\/pactech.com\/wp-content\/uploads\/2022\/11\/05.jpg 1024w\" sizes=\"(max-width: 1024px) 100vw, (max-width: 600px) 100vw, 800px\" \/><\/span><\/div><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-3 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-padding-top:100px;--awb-bg-image:linear-gradient(180deg, rgba(0,0,0,0) 0%,#000000 100%);--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:0px;--awb-margin-bottom-large:0px;--awb-spacing-left-large:0px;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:0px;--awb-spacing-left-medium:0px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:0px;--awb-spacing-left-small:0px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><\/div><\/div><\/div><\/div><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-2 fusion-flex-container has-pattern-background has-mask-background hundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-padding-top:0px;--awb-padding-right:0px;--awb-padding-left:0px;--awb-padding-right-medium:0px;--awb-padding-left-medium:0px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"width:calc( 100% + 0px ) !important;max-width:calc( 100% + 0px ) !important;margin-left: calc(-0px \/ 2 );margin-right: calc(-0px \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-4 fusion_builder_column_1_1 1_1 fusion-flex-column fusion-animated\" style=\"--awb-padding-top:100px;--awb-padding-top-small:0px;--awb-padding-bottom-small:60px;--awb-bg-blend:overlay;--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:calc( 0.05 * calc( 100% - 0px ) );--awb-margin-bottom-large:0px;--awb-spacing-left-large:calc( 0.05 * calc( 100% - 0px ) );--awb-width-medium:100%;--awb-spacing-right-medium:calc( 0.05 * calc( 100% - 0px ) );--awb-spacing-left-medium:calc( 0.05 * calc( 100% - 0px ) );--awb-width-small:100%;--awb-spacing-right-small:calc( 0.07 * calc( 100% - 0px ) );--awb-spacing-left-small:calc( 0.07 * calc( 100% - 0px ) );\" data-animationType=\"fadeInLeft\" data-animationDuration=\"2.0\" data-animationOffset=\"top-into-view\"><div class=\"fusion-column-wrapper fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-title title fusion-title-2 fusion-title-text fusion-title-size-two\" style=\"--awb-text-color:#ffffff;--awb-margin-bottom:50px;--awb-margin-top-small:10px;--awb-margin-right-small:0px;--awb-margin-bottom-small:10px;--awb-margin-left-small:0px;--awb-sep-color:#ad1d3f;\"><div class=\"title-sep-container title-sep-container-left fusion-no-large-visibility fusion-no-medium-visibility fusion-no-small-visibility\"><div class=\"title-sep sep-single sep-solid\" style=\"border-color:#ad1d3f;\"><\/div><\/div><span class=\"awb-title-spacer fusion-no-large-visibility fusion-no-medium-visibility fusion-no-small-visibility\"><\/span><h2 class=\"fusion-title-heading title-heading-left\" style=\"margin:0;\">Wafer Bumping &#8211; Maschinen<\/h2><span class=\"awb-title-spacer\"><\/span><div class=\"title-sep-container title-sep-container-right\"><div class=\"title-sep sep-single sep-solid\" style=\"border-color:#ad1d3f;\"><\/div><\/div><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-5 fusion_builder_column_1_1 1_1 fusion-flex-column fusion-animated\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:calc( 0.05 * calc( 100% - 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