Selective Post-Soldering Volume Adjustment for Improved Co-Planarity of C4 Bump Interfaces<\/a><\/p>\n<\/div><\/li> Chip Scale Review: Direct laser reflow techniques for stable and reliable solder bump interfaces on semiconductor substrates<\/a><\/p>\n<\/div><\/li><\/ul> A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications<\/a><\/p>\n<\/div><\/li> Innovative laser assisted bonding process for next generation advanced packaging<\/a><\/p>\n<\/div><\/li> Laser assisted bonding as recommended soldering technology<\/a><\/p>\n<\/div><\/li> Innovative laser assisted bonding technologies for next generation advanced packaging<\/a><\/p>\n<\/div><\/li> Advanced Laser Assisted Bonding Technologies for high-power device assembly<\/a><\/p>\n<\/div><\/li> Exploring direct laser reflow techniques for forming stable and reliable solder bump interfaces on semiconductor substrates<\/a><\/p>\n <\/p>\n<\/div><\/li><\/ul> Forming of advanced THT-interconnects using SB\u00b2 laser solder jetting process<\/a><\/p>\n<\/div><\/li> Next generation advanced packaging using innovative laser assisted bonding equipment<\/p>\n<\/div><\/li><\/ul> Versatile hermetically sealed sensor platform for high frequency applications<\/a><\/p>\n<\/div><\/li> Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures<\/a><\/p>\n<\/div><\/li> A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding<\/a><\/p>\n<\/div><\/li><\/ul> Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor platform<\/a><\/p>\n<\/div><\/li>Publikationen 2024<\/h2><\/div>
Publikationen 2023<\/h2><\/div>
Publikationen 2021<\/h2><\/div>
Publikationen 2020<\/h2><\/div>