{"id":4876,"date":"2022-11-08T13:10:22","date_gmt":"2022-11-08T21:10:22","guid":{"rendered":"https:\/\/test.pactech.com\/about-us\/"},"modified":"2025-12-19T09:53:58","modified_gmt":"2025-12-19T08:53:58","slug":"ueber-uns","status":"publish","type":"page","link":"https:\/\/pactech.com\/de\/ueber-uns\/","title":{"rendered":"\u00dcber Uns \u2013 PacTech"},"content":{"rendered":"

<\/span><\/div>

PACKAGING TECHNOLOGIES<\/h2><\/div>

WER SIND WIR?<\/span><\/h1><\/div>

PacTech ist ein technologieorientiertes Unternehmen, das sich auf die Herstellung von Advanced-Packaging-Anlagen und auf Dienstleistungen im Bereich Wafer Level Packaging spezialisiert hat. Seit unserer Gr\u00fcndung hat unser Team unerm\u00fcdlich an der Entwicklung neuer Spitzentechnologien f\u00fcr die n\u00e4chste Generation von Anwendungen gearbeitet. Wir sind daf\u00fcr bekannt, dass wir sehr anpassungsf\u00e4hig sind, wenn es um kundenspezifische und einzigartige Anwendungen geht. Unser Team von technischen Experten ist bestrebt, verschiedene Verpackungsherausforderungen der Industrie zu l\u00f6sen, um unseren Kunden und Partnern wettbewerbsf\u00e4higere L\u00f6sungen in Bezug auf Kosten, Markteinf\u00fchrungszeit und technologischen Fortschritt zu bieten. Unser Hauptsitz befindet sich in Nauen, Deutschland, mit zwei Betriebs- und Produktionsst\u00e4tten in Santa Clara, CA, USA und Penang, Malaysia. Zusammen mit unseren Vertriebs- und Au\u00dfendienstteams auf der ganzen Welt k\u00f6nnen wir die Nachfrage in Ihrer Region bedienen.<\/p>\n<\/div><\/div><\/div>

\"Advanced<\/span><\/div><\/div><\/div><\/div><\/div><\/div><\/div>
\"Advanced<\/span><\/div><\/div><\/div><\/div>

ADVANCED PACKAGING EQUIPMENT<\/h2><\/div>
<\/div><\/div>

Unser Portfolio an Advanced-Packaging-Anlagen umfasst mehrere Kerntechnologien, darunter Laser- und Drahtl\u00f6ten, lasergest\u00fctztes Bonden und innovative L\u00f6sungen f\u00fcr das Bumping auf Waferebene, wie z. B. stromloses Beschichten und Wafer-Level-Ball-Placement. Wir bieten Ausr\u00fcstungsl\u00f6sungen f\u00fcr einen hohen Durchsatz und eine vollautomatische Fertigung sowie fortschrittliche Forschungs- und Entwicklungsarbeit im Feld.<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>

WAFER LEVEL PACKAGING SERVICES<\/h2><\/div>
<\/div><\/div>

Mit unseren hochmodernen Wafer Level Bumping-, Metallisierungs- und Advanced-Packaging-Prozessen unterst\u00fctzt PacTech die Roadmap der heterogenen Integrationstechnologie. In Kombination mit unseren einzigartigen Laserl\u00f6t- und Laserbondanlagen ist PacTech in der Lage, eine Vielzahl von Fertigungs- und Konstruktionsl\u00f6sungen f\u00fcr die technischen und wirtschaftlichen Herausforderungen der heutigen Industrie anzubieten. Unsere Produktionsstandorte sind nach ISO 9001 und IATF 16949 zertifiziert, um ein H\u00f6chstma\u00df an Qualit\u00e4t und Prozesskontrolle zu gew\u00e4hrleisten. Als sozial verantwortungsbewusstes Unternehmen sind wir auch nach ISO 14001 und ISO 50001 f\u00fcr unsere Betriebe zertifiziert.<\/p>\n<\/div><\/div><\/div>

\"Clean<\/span><\/div><\/div><\/div><\/div><\/div><\/div><\/div>
\"Plating<\/span><\/div><\/div><\/div><\/div>

ChemiKALIEN<\/h2><\/div>
<\/div><\/div>

Als Anbieter schl\u00fcsselfertiger L\u00f6sungen f\u00fcr die stromlose Beschichtung liefern wir unseren Kunden komplette Prozessl\u00f6sungen, indem wir unser Beschichtungs-Know-how, unsere Anlagen und Prozesschemikalien kombinieren, um einen erfolgreichen Prozesstransfer zu gew\u00e4hrleisten. Unsere Beschichtungschemikalien werden nach h\u00f6chsten Qualit\u00e4tsstandards kontrolliert und sind \u00fcber ein weltweites Vertriebsnetz erh\u00e4ltlich, das den Import und die Lagerung abwickelt, aber auch technische Unterst\u00fctzung vor Ort f\u00fcr unsere Kunden bietet.<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>

<\/i>0<\/span><\/div>
Angestellte<\/div><\/div><\/div>
<\/i>0<\/span>+<\/span><\/div>
Maschinen produziert<\/div><\/div><\/div>
<\/i>0<\/span>+<\/span><\/div>
Patente<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

Geschichte<\/h2><\/div>
<\/div><\/div><\/div><\/div>
<\/i><\/span><\/div>

1995 - Gr\u00fcndung<\/h3><\/div>
<\/div>
\n

Berlin, als Spin-off des Fraunhofer-IZM<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/i><\/span><\/div>

1997 - Erste Produktionsst\u00e4tte<\/h3><\/div>
<\/div>
\n

PacTech GmbH, Nauen, Germany<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/i><\/span><\/div>

2001 - Zweite Produktionsst\u00e4tte<\/h3><\/div>
<\/div>
\n

PacTech USA Inc., Kalifornien, USA<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/i><\/span><\/div>

2008 - Dritte Produktionsst\u00e4tte<\/h3><\/div>
<\/div>
PacTech Asia Sdn. Bhd., Malaysia<\/div>
<\/div><\/div><\/div>
<\/i><\/span><\/div>

2015 - Demo Center<\/h3><\/div>
<\/div>
\n

Er\u00f6ffnung in Shanghai, China<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/i><\/span><\/div>

2015 - 100% \u00dcbernahme<\/h3><\/div>
<\/div>
\n

durch die Nagase & Co. Ltd., Japan<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/i><\/span><\/div>

2024 - Demo Center<\/h3><\/div>
<\/div>
\n

Er\u00f6ffnung in Seoul, S\u00fcdkorea<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/i><\/span><\/div>

2024 - Demo Center<\/h3><\/div>
<\/div>
\n

Er\u00f6ffnung in Hsinchu, Taiwan<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/i><\/span><\/div>

2025 - Erfolge bis Heute<\/h3><\/div>
<\/div>
\n

> 2.000 produzierte Maschinen ausgeliefert
\n> 218 Patente
\n<\/span>~ 460 Angestellte<\/span><\/p>\n<\/div>

<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div>
\"PacTech<\/span><\/div><\/div><\/div><\/div><\/div><\/div>

PacTech Management<\/h2><\/div>
<\/div><\/div><\/div><\/div>
<\/span>

Dr. Thorsten Teutsch<\/h3>

Managing Director | CEO<\/p><\/div><\/div><\/div><\/div><\/div>

<\/span>

Annette Burczyk<\/h3>

Authorized Signatory<\/p><\/div><\/div><\/div><\/div><\/div>

<\/span>

Thomas Oppert<\/h3>

Vice President | Sales<\/p><\/div><\/div><\/div><\/div><\/div>

<\/span>

Matthias Fettke<\/h3>

Vice President | Advanced Packaging Equipment<\/p><\/div><\/div><\/div><\/div><\/div>

<\/span>

Sy Jiun Sim<\/h3>

Vice President | Wafer Level Packaging<\/p><\/div><\/div><\/div><\/div><\/div>

<\/span>

Thorsten Krause<\/h3>

Director Equipment Technologies<\/p><\/div><\/div><\/div><\/div><\/div>

<\/span>

Ricardo Geelhaar<\/h3>

Director WLP Technologies<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

PacTech Management<\/h2><\/div>
<\/div><\/div><\/div><\/div>
<\/span>

Dr. Thorsten Teutsch<\/h2>

Managing Director | CEO<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Annette Burczyk<\/h2>

Authorized Signatory<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Thomas Oppert<\/h2>

Vice President | Sales<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Matthias Fettke<\/h2>

Vice President | Advanced Packaging Equipment<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Sy Jiun Sim<\/h2>

Vice President | Wafer Level Packaging<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Thorsten Krause<\/h2>

Director Equipment Technologies<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Ricardo Geelhaar<\/h2>

Director WLP Technologies<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

PacTech Management<\/h2><\/div>
<\/div><\/div><\/div><\/div>
<\/span>

Dr. Thorsten Teutsch<\/h2>

Managing Director | CEO<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Annette Burczyk<\/h2>

Authorized Signatory<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Thomas Oppert<\/h2>

Vice President | Sales<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Matthias Fettke<\/h2>

Vice President | Advanced Packaging Equipment<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Sy Jiun Sim<\/h2>

Vice President | Wafer Level Packaging<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Thorsten Krause<\/h2>

Director Equipment Technologies<\/p><\/div><\/div><\/div><\/div><\/div><\/div>

<\/span>

Ricardo Geelhaar<\/h2>

Director WLP Technologies<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":6,"featured_media":4395,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"content-type":"","footnotes":""},"class_list":["post-4876","page","type-page","status-publish","has-post-thumbnail","hentry"],"yoast_head":"\nPacTech Packaging Technologies | Alles Wissenswerte \u00dcber Uns<\/title>\n<meta name=\"description\" content=\"PacTech ist Ihr weltweiter Anbieter von Advanced Packaging Equipment und Dienstleistungen im Bereich Wafer Level Packaging.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/pactech.com\/de\/ueber-uns\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PacTech Packaging Technologies | Alles Wissenswerte \u00dcber Uns\" \/>\n<meta property=\"og:description\" content=\"PacTech ist Ihr weltweiter Anbieter von Advanced Packaging Equipment und Dienstleistungen im Bereich Wafer Level Packaging.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/pactech.com\/de\/ueber-uns\/\" \/>\n<meta property=\"og:site_name\" content=\"PacTech - 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