{"id":10065,"date":"2023-01-27T08:35:38","date_gmt":"2023-01-27T07:35:38","guid":{"rendered":"https:\/\/test.pactech.com\/?post_type=avada_faq&#038;p=10065"},"modified":"2023-01-27T08:39:52","modified_gmt":"2023-01-27T07:39:52","slug":"electroless-plating-on-aluminium-based-semiconductors","status":"publish","type":"avada_faq","link":"https:\/\/pactech.com\/de\/faq-items\/electroless-plating-on-aluminium-based-semiconductors\/","title":{"rendered":"Beschichtung von Halbleitern auf Aluminiumbasis"},"content":{"rendered":"<div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 fusion-flex-container has-pattern-background has-mask-background nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-padding-top:0px;--awb-padding-bottom:0px;--awb-padding-right-small:2%;--awb-padding-left-small:2%;--awb-margin-top:50px;--awb-margin-bottom:50px;--awb-margin-top-small:0px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-stretch fusion-flex-content-wrap\" style=\"max-width:1248px;margin-left: calc(-4% \/ 2 );margin-right: calc(-4% \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:1.92%;--awb-margin-bottom-large:30px;--awb-spacing-left-large:1.92%;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:1.92%;--awb-spacing-left-medium:1.92%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-title title fusion-title-1 fusion-sep-none fusion-title-text fusion-title-size-two\" style=\"--awb-text-color:#ffffff;--awb-margin-top-small:10px;--awb-margin-right-small:0px;--awb-margin-bottom-small:10px;--awb-margin-left-small:0px;\"><h2 class=\"fusion-title-heading title-heading-left\" style=\"margin:0;\">Beschichtung von Halbleitern auf Aluminiumbasis<\/h2><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:30px;--awb-spacing-right-large:1.92%;--awb-margin-bottom-large:0px;--awb-spacing-left-large:1.92%;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:1.92%;--awb-spacing-left-medium:1.92%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-1\" style=\"--awb-text-color:#ffffff;\"><p>Bei integrierten Schaltkreisen auf Aluminiumbasis umfasst die chemische Sequenz zur Abscheidung der Chemisch-Nickel-Schicht folgende Schritte:<\/p>\n<\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-2 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:1.92%;--awb-margin-bottom-large:30px;--awb-spacing-left-large:1.92%;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:1.92%;--awb-spacing-left-medium:1.92%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><ul style=\"--awb-line-height:27.2px;--awb-icon-width:27.2px;--awb-icon-height:27.2px;--awb-icon-margin:11.2px;--awb-content-margin:38.4px;--awb-circlecolor:#ad1d3f;--awb-circle-yes-font-size:14.08px;\" class=\"fusion-checklist fusion-checklist-1 fusion-checklist-default type-icons\"><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">Reinigung der Pads von organischen oder siliziumbasierten Verunreinigungen, die durch die Handhabung der Wafer, die Lagerung oder Abweichungen im Herstellungsprozess entstehen k\u00f6nnen.<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">Entfernen von nativem Oxid, das sich auf der Oberfl\u00e4che des Aluminiumpads gebildet haben k\u00f6nnte. Dies erfolgt in der Regel mit \u00c4tzchemikalien auf Laugenbasis.<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">Aktivierung der Oberfl\u00e4che des Aluminiums. Das hierf\u00fcr am h\u00e4ufigsten verwendete nasschemische System ist die &#8222;Verzinkung&#8220;, bei der eine Zinkoxidl\u00f6sung verwendet wird, um in einer elektrochemischen Reaktion einen Teil des Aluminiums des Pads durch Zink zu ersetzen. Empirische Untersuchungen haben gezeigt, dass durch das Abl\u00f6sen dieser Zinkschicht und ihre anschlie\u00dfende Neubildung in einem zweiten Verzinkungsschritt eine h\u00f6herwertige Zinkschicht entsteht (so genannte &#8222;Doppelverzinkung&#8220;). Diese Zinkschicht ver\u00e4ndert das elektrische Potenzial des Aluminiumpads, und wenn es in eine Nickelsulfatl\u00f6sung getaucht wird, ersetzt Nickel dieses Zink und eine autokatalytische Nickelreaktion setzt sich fort. Durch Einstellen von Zeit, Temperatur, pH-Wert und chemischer Konzentration des Vernickelungsbades k\u00f6nnen Nickelstrukturen mit einer Gr\u00f6\u00dfe von 1 bis 25 Mikrometern erzeugt werden.<\/div><\/li><li class=\"fusion-li-item\" style=\"\"><span class=\"icon-wrapper circle-yes\"><i class=\"fusion-li-icon fa-arrow-alt-circle-right fas\" aria-hidden=\"true\"><\/i><\/span><div class=\"fusion-li-item-content\">Bei den meisten Anwendungen schlie\u00dft sich die Abscheidung von Lot nicht unmittelbar an den Nickelabscheidungsprozess an. Da die Nickeloberfl\u00e4che relativ schnell oxidiert, wird in der Regel eine d\u00fcnne Schicht eines Edelmetalls \u00fcber dem Nickel abgeschieden, um die Oberfl\u00e4che vor Oxidation zu sch\u00fctzen. Es gibt zwei gebr\u00e4uchliche Metalle (Pd und Au), die mit dem Chemisch-Nickel-Verfahren kompatibel sind und nacheinander in derselben Beschichtungsanlage entweder im Tauchverfahren oder im stromlosen Verfahren abgeschieden werden k\u00f6nnen.<\/div><\/li><\/ul><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":6,"featured_media":0,"menu_order":3,"comment_status":"open","ping_status":"closed","template":"","format":"standard","meta":{"content-type":"","footnotes":""},"faq_category":[331],"class_list":["post-10065","avada_faq","type-avada_faq","status-publish","format-standard","hentry","faq_category-process-electroless-plating-de"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Beschichtung von Halbleitern auf Aluminiumbasis - PacTech - Packaging Technology Equipment &amp; Services<\/title>\n<meta name=\"robots\" content=\"noindex, follow\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Beschichtung von Halbleitern auf Aluminiumbasis - PacTech - Packaging Technology Equipment &amp; 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