A Study About 3D Stacking of Passive SMD Elements for Advanced SMT Packaging Using Laser Assisted Bonding
By: Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael
By: Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael
By: Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael
By: Kevin Kröhnert, Markus Wöhrmann, Michael Schiffer, Georg Friedrich, Dzmitry