Forming of Advanced THT-Interconnects using SB² Laser Solder Jetting Process
Matthias Fettke, Gero Bonow, Anne Fisch, Moshir Nasser, Georg Friedrich,
A Study About 3D Stacking of Passive SMD Elements for Advanced SMT Packaging Using Laser Assisted Bonding
By: Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael
Reliability of Through Glass Vias and Hermetically Sealing for a Versatile Sensor Plattform
By: Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael
Versatile Hermetically Sealed Sensor Platform for High Frequency Applications
By: Kevin Kröhnert, Markus Wöhrmann, Michael Schiffer, Georg Friedrich, Dzmitry
