Wafer Level Rework


Ultra-SB² 300 WLR (Wafer Level Solder Ball Rework):


Equipment to improve solder ball attach yield to 100%.

   

Specifications:

  •  Wafer size: 8" - 12"

  •  Solder ball size: 50µm - 760µm

  •  25 wafers/ hour 12 inch

  •  30 wafers/ hour8 inch

  •  automatic wafer inspection

  •  removal of misplaced balls

  •  flux dispensing

  •  replacement of missing balls

  •  update of electronic wafer map

  •  ultra fast post ball inspection
 

Solder Jetting & Rework


SB²-Jet (Laser Solder Ball Jetting System):

 
The SB²-Jet solder ball system is the ideal solution for flexible solder ball placement and laser reflow.
At a maximum speed of 10 balls  per second, it is  one of the fastest machines on the market today. Different machine platforms are available, from semiautomatic machines for prototyping and R&D as well as high volume (24/7) production machines with various possibilities of different handling systems. It provides a reproducible solder bumping technology for the packaging of :
 

Wafers, Optoelectronic Devices, MEMS, Sensors, BGA's, CSP, Flip Chips, HDD (HGA, HSA), Camera Modules

 
           


         SB²-Jet



             SB²-SM

 
         SB²-M

 

Specifications:

  • Single-step solder ball placement and reflow
  • Fluxfree reflow with laser
  • No special tooling required
  • No additional reflow required
  • Solder ball diameter from 40µm up to 760µm
  • Solder allay flexibility:
  • Eutectic & high-lead SnPb
  • Leadfree SnAg, SnAgCu, AuSn
  • In-Line capability, robot cassette to cassette handling
  • High throughput
  • Accurate positioning system
  • Ball rework & repair capability
  • Ball inspection system

 






 

 

 

 

 

 

 

 

 

 


  Solder Ball Jetting                                 

 

 

 

 


Solder Ball Removal/ Rework                       

 


 
 
 

Wafer Level Balling


Ultra-SB² 200/300 (Solder Sphere Transfer System (Gang Ball Placement)):
 




Automatic Ultra-SB² 300
         


            

Semiautomatic Ultra-SB² 200 


    

Specifications:

  •  60µm-760µm solder spheres
  •  150µm-1mm pad pitches
  •  Yield: > 250µm balls: > 99.99 %
  •  Yield: < 200µm balls: > 99.98 %
  •  Solder bump height coplanarity: < 10 µm @ 3sigma
  •  SnPb37 or Lead-free SnAgCu
  •  High throughput: 30 wafers/h incl. 2x inspection & repair
  •  Wafer sizes: 4 – 12 inch
  •  Robot Handling from cassette to cassette (optional)
  •  Low tooling cost
  •  Volume production & prototyping capability
  •  Integrated rework capability (opt.)
  •  2-D Inspection (optional)