Equipment
Wafer Level Packaging
Chemistry
Equipment
Wafer Level Packaging
Chemistry

Press Releases | News

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SPIE DSS

SPIE DSS

  2014 May 5-9; Booth 871; Baltimore, MD, USA ...

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Nepcon China

Nepcon China

2014 April 23 - 25, Booth: B-1A36 Shanghai World Expo Exhibition & Convention Center www.nepconchina.com/en/

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Newsletter

 

PAC TECH USA - Packaging Technologies Inc.

328 Martin Avenue
Santa Clara, CA 95050, USA

[Keine Beschreibung eingegeben]       

How to get to Pac Tech USA Inc.

Directions: From San Jose Int. Airport:
(5 minutes drive)

Take HWY 101 North
Turn left on DelaCruz Blvd.
Turn left on Martin Avenue


Directions: From San Francisco Int. Airport:
(50 minutes)

Take HWY 101 South
Turn right on DelaCruz Blvd.
Turn left on Martin Avenue